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Instrument Cluster Expert Group Meeting Info

The Instrument Cluster Expert Groups meets every other Tuesday at 12:00 UTC. Meeting minutes the upcoming scheduled meeting dates are listed below.

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Meeting ID: 692 477 003

Find your local number: https://zoom.us/u/ameRude4a

Meeting Minutes

May 30, 2019

Face to face meeting@Nagoya

Attendees:Ohiwa,Komatsu,Namekawa,Tanibata,Hamaguchi,Endo,Taguchi,Yagi,Yamaguchi,Mitsunari,Tohge,Haraki

  • If we define AGL Specification in R-Car, Original profile is imagined such as H3 and M3, and E3 is Hi, D3 is Lo on Cluster profile.
  • We suggested creating service that meter function in F2F of Spain. The purpose meter function service and want to reduce defrayal of the application development. with the that service, it is imagined speed, telltale, light control, buzzer, trip, variant input.
    • Each tier1 suppliers had development already that each OEM is abstracted thus They may not be in trouble
  • SUZUKI will provide sample code which becomes the draft policy of Cluster Profile in August . The architecture image of this sample code is shared in June.
  • EG decide architecture to goal for as EG. we would like to define ideal situation with this architecture that EG and community can develop comfortably.
  • Drawing performance, memory size, reference hardware etc… We aim at the architecture that can achieve a goal which function list for target hardware.

May 7, 2019

Held in conjunction with the F2F meeting in Spain.

Haraki-san presented an updated requirements matrix. Also showed a presentation. Need to upload both.

Fast boot - Typical requirement for IC is 1/2 second availability, but we need to define what is available in 500 msec and what we can hold off. Also need to define requirements for what is available in 2 seconds, etc.

cluster_eg_190508.pptx

April 23, 2019

Attendees: Walt, Jan-Simon, Michael, Stephane, Tanibata, Johann, Kurokawa

Received notice from Haraki-san and Ohiwa-san that they wanted to cancel the meeting.

Discussed a little about the proposed processor targets.

April 11, 2019

Attendees: Walt, Haraki, Kusakabe, Michele, Kurokawa, Tanibata, Oki ,Salma, Ohiwa, Johann, Stephane, Jan-Simon,

  • Haraki-san showed a spreadsheet with possible requirements for IC that is being sent to EG members to determine the both the overall requirements for the IC as well dividing the requirements by high tier and low tier IC.
    • Spreadsheet should be shared with the overall discussions mail list to attract more interest from Tier One and OEM members.
  • Reference Board Discussion
    • No progress on simulating E3/D3 using an M3. Stephane will receive an E3 by the end of April so they can do some benchmarking of the E3 to provide a proper environment in the M3.

March 26, 2019

Attendees: Walt, Haraki, Kusakabe, Oki, Tanibata, Scott, Ohiwa, Mitsunari, Stephane,

  • Reference Board Discussion
    • Stephane shared the results of work they have been doing to use an M3 to simulate an E3 or D3. This is still a work in progress.
    • Kurokawa sent an email indicating that it will be difficult for companies who are not under NDA with Renesas to obtain the E3 board from Renesas. This would exclude LF, Konsulko, and a most of the Tier 2 suppliers.
    • Denso would like to use Renesas D3 for IC
    • i.MX6 could be another candidate.

March 12, 2019

Attendees: Walt, Jan-Simon, Haraki, Yamaguchi, Kurokawa, Scott, Fulup, Stephane, Mitsunari, Ohiwa

Haraki-san made a presentation.

  1. Need to gather requirements from OEMs and Tier One suppliers
  2. Summarize requirements from OEMs and Tier Ones into a functional requirements document for Cluster and HUD
  3. Optimize services per the requirements

Suzuki will provide an initial feature list by April 1. Walt will start the Confluence page.

Need to recruit additional OEM and Tier One members to the EG to get their requirements.

OEM

  • Suzuki - Haraki-san
  • Toyota
  • Mazda

Tier One

  • Panasonic
  • Denso
  • Continental
  • Bosch (they are LF members but not currently AGL members)

Renesas working on getting E3 boards. Recommend starting with M3 and using software techniques (kernel config) to reduce the allowed cores and memory usage to simulate an E3 environment. IoT.bzh and Renesas will work together to figure out to do this. (SPEC-2254)

What do we do about demo 3 code for IC? Mitsunari and Ohiwa think this is not part of the EG-IC.

  • Will change cluster-appname repository names to something indicating that they are specifically for demo3-cluster-appname
  • It is a work-in-progress to be able to recreate building demo 3 in git. Ohiwa-san will work to make the documentation available that we need to make that happen.

March 7, 2019

F2F kickoff meeting at AMM Tokyo

Haraki-san presented slides with goals and initial schedule for EG. Target is to have a spec by November. Ideally we will review the spec at the Fall AMM and incorporate into System Spec 2.0.

Which board for initial development?

  • Need a count of board requirements for E3. Renesas will try to get 20 boards

Scott can focus on reducing image size to fit into E3 memory. Would be best to get a memory size target.

Suzuki will provide initial requirements (feature list) in Confluence by April 1.

Feature list for low end IC on a motorcycle could include

  • No additional IVI unit would be included
  • CAN and/or LIN
  • SDL with audio and Bluetooth (including HFP)
  • Small display (need size and resolution)
  • Maximum 2GB RAM
  • Hypervisor or other solution for safety features

What do we do about demo 3 code for IC?

  • Wait and see. Discuss during the May F2F meeting. Should it be merged for now
eg-ic/meetings.txt · Last modified: 2019/06/04 09:08 by ttharaki